Inside Electronics

The electronica exhibition is one of the largest and most popular events in the electronic design engineering space, bringing together people from around the world. The show will address topics such as power electronics, embedded technologies, chiplets, and cybersecurity. In this episode, Electronic Design’s own Alix Paultre and Bill Wong talk about the show, the electronics industry, and what topics may be covered at electronica.

Society is undergoing major changes, such as decarbonization, the electrification of mobility, advances in AI and high-speed communications, and demographic shifts. This evolution in the application space demands new solutions and technologies that also must continue to evolve. We talk to Samira Amani and Fabrizio Petris of Aratas about the embedded marketplace and the company’s plans to address it going forward.

Wide-bandgap technologies, silicon carbide (SiC) and gallium nitride (GaN), are transforming power applications by enabling faster switching, higher efficiency, and greater power density than traditional silicon devices, allowing engineers to design smaller, lighter, and more energy-efficient power systems. We spoke to some Nexperia executives, Filippo Scrimizzi and Olaf Vogt, about their impressions and perspectives on the power semiconductor marketplace.

In this episode of Inside Electronics, host Alix Paultre interviews Karthik Vasanth, vice president and general manager for data converters and clocks at Texas Instruments, about the technologies supporting rapidly evolving data centers. Vasanth explains how rising GPU and CPU performance increases demands on power delivery, cooling, communications, and reliability.

The conversation explores optical networking, efficient power conversion, and the transition from air cooling to liquid cooling. Vasanth describes how high-voltage DC architectures could simplify power delivery while introducing safety challenges. Precision sensing and fast control help operators manage power budgets, monitor processor health, detect leaks, and respond immediately to dangerous conditions.

He also outlines Texas Instruments’ shift from supplying individual components toward providing integrated reference designs and software that accelerate customer development.

Both speakers emphasize that power efficiency, thermal management, and reliability are interconnected. Vasanth concludes that suppliers must evolve quickly as computing advances push infrastructure requirements and development timelines at an unprecedented pace.

Emerson’s Nigel AI is built on the latest industry models, leveraging them to take advantage of rapidly evolving technology using the latest test methodologies, test system design, and data analysis. In this episode, we talk to Rudy Sengupta, Senior VP and CTO at Emerson, about the company’s efforts in next-generation AI-based test and development.