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Inside Electronics

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Inside Electronics
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92 episodios

  • Inside Electronics

    FPGAs and Time Sensitive Networking in Industrial Applications

    16/12/2025 | 13 min

    In this episode, Electronic Design talks to Karl Wachswender, Senior Principal System Architect at Lattice Semiconductor. Lattice is well known for its power efficient FPGAs that support artificial intelligence (AI) applications. They also address post-quantum cryptography, and are found in demanding applications like automotive. 

  • Inside Electronics

    Creating On-Chip MEMS Sensors in CMOS

    09/12/2025 | 15 min

    Nanusens creates nanoscale sensor structures inside the CMOS layers using standard CMOS processes within the same production flow as making the control electronics on the same chip. This approach reduces the size and cost as it benefits from the vast economies of scale of using giant CMOS fabs. The resulting single chip solution has a packaged size of 0.5 mm³. This episode delves into the technology, its future, and some limitations.

  • Inside Electronics

    Utilizing Time-Sensitive Networking in Industrial Control

    02/12/2025 | 9 min

    Christian Bornschein, Manager of Marketing & Sales at Port Industrial Automation, talks about how Time-Sensitive Networking (TSN) is employed in industrial automation. We also discuss some real-world examples and how TSN enables simpler, more effective industrial control product development. 

  • Inside Electronics

    RAID in the NVMe Era

    25/11/2025 | 23 min

    RAID, redundant array of independent disks, uses redundancy to provide a more robust disk drive array capable of operation even with the loss of a drive. RAID 1 replicates data with a 50% overhead. RAID 5 and 6 are more common in larger arrays with less overhead as more drives are added to the mix but with a tradeoff in performance.   Mark Anthony, Product Line Manager at Microchip Technology, talks about the company's SmartRAID 4300 Series, which is designed to accelerate the operation of RAID arrays implemented build on NVMe drives.

  • Inside Electronics

    The Importance of Chipscale Packaging in Electronics

    18/11/2025 | 18 min

    AI workloads and other advanced computing applications continue to expand, pressuring the development community with the dual challenges of performance and manufacturability. Traditional SoCs are approaching their limits in terms of size, yield, and cost, and one solution lies in chiplet-based architectures. In this episode, we talk to Larry Zu, CEO at Sarcina Technology, and how the company is deploying interconnect to minimize signal crosstalk and enhance signal integrity.

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Electronic Design has been serving the engineering community with pride for decades, providing news, commentary, and interviews about the industry. Hosted by industry veteran Alix Paultre, the Inside Electronics podcast brings you commentary, news, and interviews about the things going on in the electronic design engineering community and its surrounding business ecosystem.
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